How to Select a Heat Sink

نویسنده

  • Seri Lee
چکیده

With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management bmomes a more and more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability y and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Numerical investigating the gas slip flow in the microchannel heat sink using different materials

In this work, slip flow of helium gas has been studied in a three dimensional rectangular microchannel heat sink with 11 microchannel and 10 rectangular fins. Helium gas flow is considered ideal and incompressible. The finite volume method with using coupled algorithm is employed to carry out the computation. To validate the present work, comparison with numerical and experimental studies is do...

متن کامل

A numerical investigation of heat transfer and pressure drop in a novel cylindrical heat sink with helical minichannels

This study numerically investigated heat transfer and fluid flow characteristics in a novel cylindrical heat sink with helical minichannels for the laminar flow of fluid with temperature-dependent properties. A finite volume method was employed to obtain the solution of governing equations. The effects of helical angle, channel aspect ratio, and Reynolds number, which were regarded as main para...

متن کامل

Effect of Using Nano Encapsulated Phase Change Material on Thermal Performance of Micro Heat Sink

The aim of this paper is to enhance thermal performance of a microchannel heat sink by using nanoencapsulated phase change material (NEPCM) slurry as a cooling fluid instead of pure fluid. A threedimensional model of a circular channel using water slurry of NEPCM was developed. The results show a significant reduction in the mean fluid temperature along the channel and heat sink wall temperatu...

متن کامل

Experimental study of convective heat transfer coefficient of MgO nanofluid in a cylindrical microchannel heat sink

Convective heat transfer of MgO-water nanofluid in a microchannel heat sink is experimentally investigated in various concentrations of 0.01, 0.05, 0.1, and 0.6 wt%. The microchannel consisted of 48 parallel rectangular cross section channels with the height of 800 µm, width of 524 µm and length of 52 mm. A well stability duration (ca. 1 month) was resulted by a 180 min ultra-sonication of the ...

متن کامل

An experimental assessment of nanostructured materials embedded in a PCM-based heat sink for transient thermal management of electronic

In the present paper, an experimental assessment was performed on the transient thermal performance of a heat sink filled by a phase change material (PCM) and PCM embedded with carbon nanofibers (CNFs) and titania (TiO2) nanoparticles as nanostructured materials. In order to enhance the thermal conductivity of PCM, CNFs and TiO2 nanoparticles at different loadings (0.5wt. % and 2 wt.% of CNFs a...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 1996